SMT ke e 'ngoe ea likarolo tsa motheo tsa likarolo tsa elektronike, tse bitsoang mekhoa ea kopano ea ka ntle, e arotsoe ka pin kapa e khutšoanyane, ke ka ts'ebetso ea reflow soldering kapa dip soldering ho tjheseletsa kopano ea mekhoa ea kopano ea potoloho, hape ke hona joale e ratoang ka ho fetisisa indasteri ea kopano ea elektroniki mokhoa.Ka ts'ebetso ea thekenoloji ea SMT ho kenya likarolo tse nyane le tse bobebe, e le hore boto ea potoloho e phethe sebaka se phahameng, litlhoko tsa miniaturization, tse mabapi le litsebo tsa ts'ebetso ea SMT li kopa ho feta.
I. SMT sebetsa solder peista hlokahala ho ela hloko
1. Mocheso o sa khaotseng: bohato ba mocheso oa polokelo ea sehatsetsing oa 5 ℃ -10 ℃, ka kopo u se ke ua ea ka tlase ho 0 ℃.
2. Ho tsoa polokelong: e tlameha ho lumellana le litataiso tsa moloko oa pele pele ho tsoa, u se ke ua theha solder peista ka nako ea polokelo ea sehatsetsi e telele haholo.
3. Ho hatsetsa: Etsa sehatsetsi sa solder ka tlhaho bonyane lihora tse 4 ka mor'a hore ue ntše ka sehatsetsing, u se ke ua koala sekoahelo ha u hatsetsa.
4. Boemo: Thempereichara ea workshop ke 25±2℃ le mongobo o lekanyelitsoeng ke 45% -65%RH.
5. Sekoahelo sa khale sa solder: Kamora ho bula sekoaelo sa sehatsetsing nakong ea lihora tse 12 hore u ka se sebelisa, haeba u hloka ho se boloka, ka kopo sebelisa botlolo e hloekileng e se nang letho ho tlatsa, ebe u e koalloa hape ka sehatsetsing ho boloka.
6. ka palo ea peista ka stencil: lekhetlo la pele ka palo ea solder peista ka stensele, e le hore ho hatisa ho potoloha u se ke ua tšela scraper bophahamo ba 1/2 e le molemo, etsa tlhahlobo ka mafolofolo, ka khothalo tlatsetso ea. linako tsa ho eketsa chelete e nyane.
II.Mosebetsi oa khatiso oa SMT chip o hlokahalang ho ela hloko
1. scraper: lisebelisoa tsa scraper li molemo ka ho fetisisa ho amohela tšepe ea tšepe, e loketseng ho hatisa ho PAD solder paste molding le ho hlobolisa filimi.
Scraper angle: khatiso ea matsoho bakeng sa likhato tse 45-60;khatiso ea mochine bakeng sa likhato tse 60.
Lebelo la ho hatisa: buka ea 30-45mm / min;mochine 40mm-80mm / min.
Maemo a ho hatisa: mocheso ho 23±3℃, mongobo o lekanyelitsoeng 45% -65%RH.
2. Stencil: Pula ea stencil e itšetlehile ka botenya ba stencil le sebōpeho le karolo ea ho bula ho latela kopo ea sehlahisoa.
3. QFP / CHIP: sebaka se bohareng se ka tlaase ho 0.5mm le 0402 CHIP se hloka ho buloa ka laser.
Stencil ea teko: ho emisa teko ea tsitsipano ea stencil hang ka beke, boleng ba tsitsipano bo kōptjoa hore bo be ka holimo ho 35N / cm.
Ho hloekisa stencil: Ha u ntse u hatisa 5-10 PCBs, hlakola stensele hang ka pampiri ea ho hlakola lerōle.Ha ho li-rags tse lokelang ho sebelisoa.
4. Moemeli oa ho hloekisa: IPA
Solvent: Tsela e molemohali ea ho hloekisa stencil ke ho sebelisa IPA le li-solvents tsa joala, u se ke ua sebelisa li-solvents tse nang le chlorine, hobane li tla senya sebopeho sa solder paste le ho ama boleng.
Nako ea poso: Jul-05-2023