Tlhahlobo ea SPI ke ts'ebetso ea tlhahlobo ea theknoloji ea ts'ebetso ea SMD, eo haholo-holo e bonang boleng ba khatiso ea solder paste.
Lebitso le felletseng la Senyesemane la SPI ke Solder Paste Inspection, molao-motheo oa eona o ts'oana le AOI, ke ka ho fumana optical ebe o hlahisa litšoantšo ho fumana boleng ba eona.
Molao-motheo oa ts'ebetso oa SPI
Ka tlhahiso ea boima ba pcba, baenjiniere ba tla hatisa mapolanka a seng makae a pcb, SPI ka hare ho khamera ea mosebetsi e tla nka litšoantšo tsa PCB (pokello ea data ea khatiso), ka mor'a hore algorithm e hlahlobe setšoantšo se hlahisoang ke sebopeho sa mosebetsi, ebe ka letsoho ho netefatsa hore na ho lokile.haeba ho lokile, e tla ba boto ea solder ho peista ya data khatiso e le maemo a referense bakeng sa tlhahiso e ileng ea latela boima tla thehoa ya data khatiso ho etsa kahlolo!
Ke hobane'ng ha SPI e hlahlojoa
Ka indasteri, ho feta 60% ea bofokoli ba soldering e bakoa ke khatiso e fokolang ea solder paste, kahoo ho eketsa cheke ka mor'a khatiso ea solder paste ho feta ka mor'a mathata a soldering ebe o khutlela mokhatlong oa basebetsi ho boloka litšenyehelo.Hobane SPI tlhahlobo ile a fumana mpe, o ka ka ho toba ho tloha boema-kepe seteishene ho theola pcb mpe, hlatsoa theoha peista solder holim'a mapheo a ka reprinted, haeba ka morao ea solder e tsitsitseng ebe o ile a fumana, ka nako eo o lokela ho sebelisa tšepe. ho lokisa kapa esita le ho lahla.Ha re bua hantle, o ka boloka litšenyehelo
Ke lintlha life tse mpe tseo SPI e li hlokomelang
1. Solder paste printing offset
Solder peista khatiso ea offset e tla etsa hore sefika se emeng kapa tjheseletsa e se nang letho, hobane solder peista offset pheletsong e le 'ngoe ea letlapa, ka solder ho qhibiliha mocheso, lipheletsong tse peli tsa solder peista mocheso qhibiliha tla hlaha phapang ea nako, angoa ke tsitsipano, pheletsong e 'ngoe. e ka sotheha.
2. Solder peista khatiso flatness
Solder peista khatiso flatness e bontša hore pcb pad holim'a solder peista ha se bataletseng, thini ho feta qetellong e 'ngoe, tlase thini qetellong e 'ngoe, e tla boela etsa hore potoloho e khutsoanyane kapa kotsi ea ho ema seemahale.
3. Botenya ba khatiso ea solder paste
Solder peista printing botenya ke e nyenyane haholo kapa e ngata haholo solder peista dutla khatiso, e tla baka kotsi ea soldering se nang letho solder.
4. Solder peista khatiso hore na ho hula ntlha
Solder peista khatiso hula ntlha le solder peista flatness e tšoana, hobane solder peista ka mor'a khatiso ho lokolla hlobo, haeba ka potlako haholo butle haholo ka 'na hlaha hula ntlha.
Litlhaloso tsa Mochini oa NeoDen S1 SPI
Sistimi ea phetisetso ea PCB: 900±30mm
Boholo ba PCB: 50mm×50mm
Boholo ba PCB: 500mm×460mm
Botenya ba PCB: 0.6mm ~ 6mm
Phapang ea moeli oa poleiti: holimo: 3mm tlase: 3mm
Lebelo la phetisetso: 1500mm/s (MAX)
Puseletso ea ho kobeha ka poleiti: <2mm
Lisebelisoa tsa mokhanni: AC servo motor system
Ho beha ho nepahala: <1 μm
Lebelo la ho tsamaea: 600mm / s
Nako ea poso: Jul-20-2023