Mochini oa ho Hlahloba oa SPI

Tlhahlobo ea SPI ke ts'ebetso ea tlhahlobo ea theknoloji ea ts'ebetso ea SMD, eo haholo-holo e bonang boleng ba khatiso ea solder paste.

Lebitso le felletseng la Senyesemane la SPI ke Solder Paste Inspection, molao-motheo oa eona o ts'oana le AOI, ke ka ho fumana optical ebe o hlahisa litšoantšo ho fumana boleng ba eona.

 

Molao-motheo oa ts'ebetso oa SPI

Ka tlhahiso ea boima ba pcba, baenjiniere ba tla hatisa mapolanka a seng makae a pcb, SPI ka hare ho khamera ea mosebetsi e tla nka litšoantšo tsa PCB (pokello ea data ea khatiso), ka mor'a hore algorithm e hlahlobe setšoantšo se hlahisoang ke sebopeho sa mosebetsi, ebe ka letsoho ho netefatsa hore na ho lokile.haeba ho lokile, e tla ba boto ea solder ho peista ya data khatiso e le maemo a referense bakeng sa tlhahiso e ileng ea latela boima tla thehoa ya data khatiso ho etsa kahlolo!

 

Ke hobane'ng ha SPI e hlahlojoa

Ka indasteri, ho feta 60% ea bofokoli ba soldering e bakoa ke khatiso e fokolang ea solder paste, kahoo ho eketsa cheke ka mor'a khatiso ea solder paste ho feta ka mor'a mathata a soldering ebe o khutlela mokhatlong oa basebetsi ho boloka litšenyehelo.Hobane SPI tlhahlobo ile a fumana mpe, o ka ka ho toba ho tloha boema-kepe seteishene ho theola pcb mpe, hlatsoa theoha peista solder holim'a mapheo a ka reprinted, haeba ka morao ea solder e tsitsitseng ebe o ile a fumana, ka nako eo o lokela ho sebelisa tšepe. ho lokisa kapa esita le ho lahla.Ha re bua hantle, o ka boloka litšenyehelo

 

Ke lintlha life tse mpe tseo SPI e li hlokomelang

1. Solder paste printing offset

Solder peista khatiso ea offset e tla etsa hore sefika se emeng kapa tjheseletsa e se nang letho, hobane solder peista offset pheletsong e le 'ngoe ea letlapa, ka solder ho qhibiliha mocheso, lipheletsong tse peli tsa solder peista mocheso qhibiliha tla hlaha phapang ea nako, angoa ke tsitsipano, pheletsong e 'ngoe. e ka sotheha.

2. Solder peista khatiso flatness

Solder peista khatiso flatness e bontša hore pcb pad holim'a solder peista ha se bataletseng, thini ho feta qetellong e 'ngoe, tlase thini qetellong e 'ngoe, e tla boela etsa hore potoloho e khutsoanyane kapa kotsi ea ho ema seemahale.

3. Botenya ba khatiso ea solder paste

Solder peista printing botenya ke e nyenyane haholo kapa e ngata haholo solder peista dutla khatiso, e tla baka kotsi ea soldering se nang letho solder.

4. Solder peista khatiso hore na ho hula ntlha

Solder peista khatiso hula ntlha le solder peista flatness e tšoana, hobane solder peista ka mor'a khatiso ho lokolla hlobo, haeba ka potlako haholo butle haholo ka 'na hlaha hula ntlha.

N10+ka botlalo-ka tsela e iketsang

Litlhaloso tsa Mochini oa NeoDen S1 SPI

Sistimi ea phetisetso ea PCB: 900±30mm

Boholo ba PCB: 50mm×50mm

Boholo ba PCB: 500mm×460mm

Botenya ba PCB: 0.6mm ~ 6mm

Phapang ea moeli oa poleiti: holimo: 3mm tlase: 3mm

Lebelo la phetisetso: 1500mm/s (MAX)

Puseletso ea ho kobeha ka poleiti: <2mm

Lisebelisoa tsa mokhanni: AC servo motor system

Ho beha ho nepahala: <1 μm

Lebelo la ho tsamaea: 600mm / s


Nako ea poso: Jul-20-2023

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