SMT ke thekenoloji ea holim'a metsi, 'me hajoale ke theknoloji le ts'ebetso e tsebahalang haholo indastering ea likopano tsa elektroniki.Ho beoa ha SMT ho bolela letoto la lits'ebetso tse thehiloeng ho PCB ka nako e khuts'oane.PCB e bolela boto ea potoloho e hatisitsoeng.
Tshebetso
Likarolo tsa mantlha tsa ts'ebetso ea SMT: khatiso ea solder paste ->Mochini o kenyang SMTho beoa -> holim'a pheko ea ontong ->reflow ontongsoldering –> AOI optical inspection –> lokisa –> sub-board –> grinding board –> wash board.
1. Khatiso ea solder paste: Karolo ea eona ke ho lutla pente e se nang thini ho lipampiri tsa PCB, ho itokisetsa ho cheselletsa likarolo.Thepa e sebelisoang ke mochine oa khatiso oa skrine, o ka pele ho mohala oa tlhahiso ea SMT.
2. Chip mounter: karolo ea eona ke ho kenya ka nepo likarolo tsa kopano ea bokaholimo sebakeng se tsitsitseng sa PCB.Thepa e sebelisoang ke mochini o phahamisang thepa, o teng moleng oa tlhahiso ea SMT ka mor'a mochine oa khatiso oa skrine.
3. Ho phekola ka ontong: karolo ea eona ke ho qhibiliha sekhomaretsi sa SMD, e le hore likarolo tsa kopano le PCB li kopane ka thata.Thepa e sebelisetsoang ho phekola ontong, e moleng oa tlhahiso ea SMT ka morao ho mochini o behang.
4. Reflow ontong soldering: karolo ea eona ke ho qhibiliha peista ea solder, e le hore likarolo tsa kopano le PCB li kopane ka thata.Thepa e sebelisoang ke onto ea reflow, e fumanehang moleng oa tlhahiso ea SMT ka morao ho bonder.
5. Mochini oa SMT AOItlhahlobo ea mahlo: karolo ea eona ke ho kopanya boto ea PCB bakeng sa boleng ba tlhahlobo ea welding le boleng ba kopano.Thepa e sebelisoang ke ho hlahloba ka mokhoa o itekanetseng (AOI), molumo oa taelo hangata o feta likete tse leshome, molumo oa taelo o monyenyane ka ho hlahloba ka letsoho.Sebaka ho latela litlhoko tsa ho sibolloa, se ka hlophisoa moleng oa tlhahiso sebakeng se loketseng.Tse ling li ka har'a solder ea reflow pele, tse ling li le ka mor'a ho soasoa ka reflow.
6. Tlhokomelo: karolo ea eona ke ho lemoha ho hlōleha ha boto ea PCB bakeng sa ho sebetsa hape.Lisebelisoa tse sebelisitsoeng ke litšepe tsa solder, li-workstations, joalo-joalo. Li hlophisitsoe tlhahlobo ea mahlo ea AOI kamora moo.
7. Sub-board: karolo ea eona ke ho khaola li-multi-linked board PCBA, e le hore e arohane ho theha motho ea ikemetseng, ka kakaretso a sebelisa mokhoa oa V-seha le mochine oa ho itšeha.
8. Boto ea ho sila: karolo ea eona ke ho senya likarolo tsa burr, e le hore li be boreleli le tse bataletseng.
9. Boto ea ho hlatsoa: karolo ea eona ke ho kopanya boto ea PCB ka holim'a masala a kotsi a tjheseletsa joalo ka flux e tlositsoeng.E arotsoe ka ho hloekisa ka letsoho le ho hloekisa mochine oa ho hloekisa, sebaka se ke keng sa lokisoa, se ka ba inthaneteng, kapa ha se inthaneteng.
Likarolo tsaNeoDen10ho khetha le ho beha mochini
1.Equips khamera ea matšoao a mabeli + mahlakore a mabeli a holimo a holimo a holimo a fofang a netefatsa lebelo le ho nepahala, lebelo la sebele ho fihlela ho 13,000 CPH.Ho sebelisa algorithm ea ho bala ea nako ea 'nete ntle le liparamente tsa ho bala ka lebelo.
2.Ka pele le ka morao e nang le litsamaiso tsa 2 tsa moloko oa bone oa lebelo le phahameng la ho lemoha lik'hamera, li-sensor tsa US ON, lense ea indasteri ea 28mm, bakeng sa lithunya tse fofang le ho lemoha ho nepahala ho phahameng.
Lihlooho tse ikemetseng tse 3.8 tse nang le sistimi ea taolo e koetsoeng ka botlalo e ts'ehetsa li-feeder tsa 8mm ka nako e le 'ngoe, ka potlako ho fihla ho 13,000 CPH.
4.Support 1.5M LED light bar placement (khetho ea khetho).
5.Phahamisa PCB ka tsela e iketsang, e boloka PCB ka boemo bo tšoanang holim'a boemo nakong placement, etsa bonnete ba ho nepahala phahameng.
Nako ea poso: Phup-09-2022