Chip Component Pad Design Mefokolo

1. 0.5mm pitch QFP pad bolelele e telele haholo, e bakang potoloho e khutšoanyane.

2. Li-socket pads tsa PLCC li khutšoanyane haholo, e leng se etsang hore ho be le soldering ea bohata.

3. Bolelele ba IC bo bolelele haholo 'me palo ea peista ea solder e kholo e bakang potoloho e khuts'oane nakong ea ho phalla hape.

4. Mapheo a mapheo a mapheo a malelele haholo a ama ho tlatsa serethe sa solder le ho kolobisa serethe hampe.

5. Bolelele ba "pad" ba likarolo tsa chip bo khuts'oane haholo, bo baka mathata a ho solder joalo ka ho fetoha, potoloho e bulehileng, le ho se khone ho solder.

6. Bolelele bo bolelele ba likarolo tsa chip bo baka mathata a solder joalo ka seemahale se emeng, potoloho e bulehileng, le thini e nyane ka manonyeletso a solder.

7. Bophara ba "pad" bo pharaletse haholo bo bakang likoli joalo ka karolo ea ho falla, solder e se nang letho le thini e sa lekaneng holim'a pampiri.

8. Bophara ba "pad" bo pharaletse haholo 'me boholo ba sephutheloana ha bo tsamaellane le pad.

9. Solder pad bophara e moqotetsane, ama boholo ba ho qhibilihisoa ha solder hammoho le karolo ea solder qetellong le PCB pads ka motsoako oa tšepe holim'a metsi ho hasana ho ka fihla, ama sebopeho sa solder lenonyello, ho fokotsa ho tšepahala ha lenonyello solder. .

10.Li-solder pads li amana ka ho toba le libaka tse kholo tsa foil ea koporo, e leng se bakang mefokolo e kang liemahale tse emeng le soldering ea bohata.

11. Solder pad pitch e kholo haholo kapa e nyane haholo, karolo e qetellang ea solder e ke ke ea kopana le pad overlap, e tla hlahisa mefokolo joalo ka seemahale se emeng, phalliso, le solder ea bohata.

12. Sebaka sa li-solder pad se seholo haholo se bakang ho sitoa ho theha manonyeletso a solder.

K1830 SMT mohala oa tlhahiso


Nako ea poso: Jan-14-2022

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