Substrate kapa intermediate layer ke karolo ea bohlokoa haholo ea sephutheloana sa BGA, se ka sebelisoang bakeng sa taolo ea impedance le bakeng sa ho kopanya li-inductor/resistor/capacitor ho phaella ho lithapo tse hokahaneng.Ka hona, thepa ea substrate e hlokahalang ho ba le mocheso o phahameng oa phetoho ea likhalase rS (hoo e ka bang 175 ~ 230 ℃), botsitso bo phahameng le ho monya mongobo o fokolang, ts'ebetso e ntle ea motlakase le ho tšepahala ho phahameng.Filimi ea tšepe, lera la ho kenya letsoho le mecha ea litaba ea substrate le eona e lokela ho ba le thepa e phahameng ea ho khomarela pakeng tsa bona.
1. The ambalaji tshebetso ya loto bonded PBGA
① Tokiso ea karoloana ea PBGA
Laminate e tšesaane haholo (12 ~ 18μm thick) foil ea koporo mahlakoreng ka bobeli a BT resin/glass core board, ebe o phunya masoba le ho phunya ka lesoba.Ts'ebetso e tloaelehileng ea PCB hammoho le 3232 e sebelisoa ho theha lits'oants'o mahlakoreng ka bobeli a substrate, joalo ka likhoele tsa tataiso, li-electrode, le likarolo tsa sebaka sa solder bakeng sa libolo tse ntseng li holisoa.Joale mask a solder a eketsoa 'me litšoantšo li bōptjoa ho pepesa li-electrode le libaka tsa solder.Ho ntlafatsa katleho ea tlhahiso, substrate hangata e na le likaroloana tse ngata tsa PBG.
② Phallo ea Ts'ebetso ea ho paka
Mokotla o mosesaane → sehiloeng se sehiloeng → ho tlama ha chip → ho hloekisoa ha plasma → tlamahano ea lead → ho hloekisoa ha plasma → sephutheloana se bōpiloeng → kopano ea libolo tsa solder → solder ea ontong ea reflow → ho tšoaea bokaholimo → karohano → tlhahlobo ea ho qetela → sephutheloana sa tlhahlobo
Chip bonding e sebelisa sekhomaretsi sa epoxy se tletseng silevera ho tlama chip ea IC ho substrate, ebe ho kopanya terata ea khauta ho sebelisoa ho hlokomela khokahano lipakeng tsa chip le substrate, e lateloe ke encapsulation ea polasetiki e entsoeng kapa sekhomaretsi sa metsi ho sireletsa chip, mela ea solder. le pads.Sesebediswa se ikgethileng sa ho thonaka se sebediswa ho beha dibolo tsa solder 62/36/2Sn/Pb/Ag kapa 63/37/Sn/Pb tse nang le ntlha e qhibidihang ya 183°C le bophara ba 30 mil (0.75mm) hodima li-pads, le reflow soldering li etsoa ka ontong e tloaelehileng ea reflow, e nang le mocheso o phahameng oa ho sebetsa o sa feteng 230 ° C.Joale substrate e hloekisoa ka centrifugally ka CFC inorganic cleaner ho tlosa solder le fiber particles tse setseng holim'a sephutheloana, ho lateloa ke ho tšoaea, ho arohana, tlhahlobo ea ho qetela, tlhahlobo le ho paka bakeng sa polokelo.Ka holimo ke ambalaji tshebetso ya etella pele bonding mofuta PBGA.
2. Ts'ebetso ea ho paka ea FC-CBGA
① Letlapa la Ceramic
The substrate ea FC-CBGA ke multilayer ceramic substrate, eo ho leng thata ho e etsa.Hobane substrate e na le li-wiring tse phahameng, sebaka se senyenyane, le tse ngata ka likoti, hammoho le tlhokahalo ea coplanarity ea substrate e phahameng.Ts'ebetso ea eona e ka sehloohong ke: pele, lipampiri tsa li-ceramic tsa multilayer li kopantsoe ka mocheso o phahameng ho theha substrate ea multilayer ceramic metallized, ebe mohala oa tšepe oa multilayer o etsoa holim'a substrate, ebe ho etsoa plating, joalo-joalo Kopanong ea CBGA , ho se lumellane ha CTE pakeng tsa substrate le chip le PCB board ke eona ntho e ka sehloohong e bakang ho hlōleha ha lihlahisoa tsa CBGA.Ho ntlafatsa boemo bona, ntle le sebopeho sa CCGA, substrate e 'ngoe ea ceramic, HITCE ceramic substrate, e ka sebelisoa.
②Ho phalla ha mokhoa oa ho paka
Ho lokisoa ha li-disc bumps -> disc cutting -> chip flip-flop le reflow soldering -> ho tlatsa ka tlaase ho mafura a mocheso, ho ajoa ha solder ea ho tiisa -> capping -> kopano ea libolo tsa solder -> reflow soldering -> ho tšoaea -> karohano -> tlhahlobo ea ho qetela -> tlhahlobo -> ho paka
3. Mokhoa oa ho paka oa lead bonding TBGA
① Theipi e tsamaisang TBGA
Theipi e tsamaisang TBGA hangata e entsoe ka thepa ea polyimide.
Ka tlhahiso, mahlakoreng ka bobeli a theipi e tsamaisang thepa ke pele a koahetsoeng ka koporo, ebe nickel le khauta e pentiloe, e lateloa ke ho phunya ka sekoting le ka-hole metallization le tlhahiso ea litšoantšo.Hobane ka har'a TBGA ena e kopantsoeng le lead, sink ea mocheso e kentsoeng e boetse ke karolo e tiileng le e tiileng le ea mantlha ea khetla ea tube, ka hona theipi e tsamaisang e hokahantsoe le sekoting sa mocheso ho sebelisoa sekhomaretsi se nang le khatello ea maikutlo pele se kenngoa.
② Phallo ea ts'ebetso ea encapsulation
Ho fokotsa chip → ho khaola chip → chip bonding → ho hloekisa → tlamahano ea loto → tlhoekiso ea plasma → pitsa ea metsi e tiisitsoeng → kopano ea libolo tsa solder → ho soasoa ka bokaholimo → karohano → tlhahlobo ea ho qetela → teko → sephuthelo
Zhejiang NeoDen Technology Co., LTD., E thehiloe ka 2010, ke moetsi ea hloahloa ea khethehileng ka mochini oa ho khetha le ho beha sebaka sa SMT, onto ea reflow, mochini oa khatiso oa stencil, mohala oa tlhahiso ea SMT le Lihlahisoa tse ling tsa SMT.
Re lumela hore batho ba baholo le balekane ba etsa NeoDen k'hamphani e ntle haholo le hore boitlamo ba rona ho Boqapi, Phapano le Tšireletseho bo netefatsa hore othomathike ea SMT e fumaneha ho motho e mong le e mong ea ratang ho itlosa bolutu hohle.
Eketsa: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Profinseng ea Zhejiang, Chaena
Mohala: 86-571-26266266
Nako ea poso: Feb-09-2023