PCBA processing ka sekhahla ha e le hantle sehlahisoa ho tloha tshebetsong e fetileng ho tshebetso e latelang pakeng tsa nako e hlokahalang ho ja, ebe nako e fokolang, e phahameng ea katleho, e phahameng ea tekanyo ea lihlahisoa, ka mor'a tsohle, feela ha sehlahisoa sa hau se se na mathata. ho phallela mohatong o latelang.Ka taba ena re bua ka moloko oa solder manonyeletso a PCBA tjheseletsa hula ntlha le tharollo:
1. PCB oa potoloho boto ka preheating sethaleng mocheso ke tlaase haholo, preheating nako e khutšoanyane haholo, e le hore PCB le motsoako sesebediswa mocheso tlaase, likarolo tjheseletsa le PCB mocheso absorption generated convex punch tšekamelo.
2. SMT placement welding thempereichara e tlase haholo kapa lebelo la lebanta la conveyor le potlakile haholo, e le hore viscosity ea solder e qhibilihisitsoeng e be kholo haholo.
3. electromagnetic pump wave soldering machine wave height e phahame haholo kapa pini e telele haholo, hoo karolo e ka tlase ea pinana e ke keng ea kopana le tlhōrō ea maqhubu.Hobane mochini o sollang oa pompo ea motlakase ke leqhubu le sekoti, botenya ba leqhubu le sekoti ke 4 ~ 5mm.
4. Ts'ebetso e mpe ea phallo.
5. Likarolo tsa lik'hatriji tsa DIP li etella pele bophara le karolelano ea lesoba la cartridge ha li nepahale, lesoba la cartridge le leholo haholo, le monya mocheso o moholo oa pad.
Lintlha tse ka holimo tsa bothata ke lintlha tsa bohlokoa ka ho fetisisa molokong oa solder joint hula tip, kahoo re tlameha ho etsa optimization e lumellanang le tokiso bakeng sa mathata a ka holimo ho smt placement processing, ho rarolla bothata pele bo etsahala, ho etsa bonnete ba hore lihlahisoa tsa lihlahisoa le lihlahisoa tsa lihlahisoa li etsoa. lebelo la ho pepa.
1. Tin wave mocheso oa 250 ℃ ± 5 ℃, nako ea ho tjheseletsa 3 ~ 5s;mocheso ke hanyenyane ka tlase, lebelo la lebanta la conveyor ho fokotsa ba bang.
2. bophahamo ba maqhubu ka kakaretso bo laoloa ho 2/3 ea botenya ba boto e hatisitsoeng.Moetso oa likarolo tse kentsoeng o hloka hore likaroloana tsa phini li hlahisoe ho tse hatisitsoeng
3. Board soldering holim 0.8mm ~ 3mm.
4. Ho nkela sebaka sa phallo.
5. Bophara ba lesoba la lesoba la cartridge ke 0.15 ~ 0.4mm e kholo ho feta bophara ba lead (letoto le letle le nka mola o ka tlase, moetapele o teteaneng o nka moeli o ka holimo).
Likarolo tsa NeoDen IN6 Reflow Oven
1. Convection e feletseng, ts'ebetso e babatsehang ea soldering.
2. Moralo oa libaka tse 6, o bobebe ebile o kopane.
3. Taolo e bohlale e nang le sensor e phahameng ea kutlo, mocheso o ka tsitsisoa ka hare ho + 0.2 ℃.
4. Sistimi ea sefa ea mosi ea pele e hahiloeng ka har'a solder, ponahalo e ntle le eco-friendly.
5. Moralo oa tšireletso ea mocheso oa mocheso, mocheso oa casing o ka laoloa ka hare ho 40 ℃.
6. Phepelo ea motlakase ea lapeng, e bonolo ebile e sebetsa.
Nako ea poso: Jun-20-2023