Kenyelletso ea seteishene sa soldering sa BGA
Seteishene sa solder sa BGAe boetse e bitsoa BGA rework station, e leng thepa e khethehileng e sebelisoang ho li-chips tsa BGA tse nang le mathata a ho soasoa kapa ha li-chips tse ncha tsa BGA li hloka ho nkeloa sebaka.Kaha tlhokahalo ea mocheso oa BGA chip welding e batla e phahame, kahoo sesebelisoa se akaretsang sa ho futhumatsa ha se khone ho finyella litlhoko tsa sona.
Tafole ea solder ea BGA e sebetsa le maemoreflow ontongcurve, kahoo ho sebetsa hantle haholo ho etsa rework ea BGA, 'me sekhahla sa katleho se ka fihla ho feta 98% haeba se etsoa ka tafole e ntle ea BGA soldering.
Classification ea BGA rework tafole
1. Mohlala oa matsoho
Ha BGA e behiloe PCB, e itšetlehile ka phihlelo ea opareitara ho ho peista ho ea ka lesira la khatiso foreime ka PCB, e leng a loketse bakeng sa BGA chip reworking le kholoanyane BGA solder bolo sekontiri se metsi (ka holimo 0,6).Ntle le mocheso oa mocheso ha mocheso o ntse o sebelisoa ka bohona, lits'ebetso tse ling kaofela li hloka ts'ebetso ea matsoho.
2. Semi-automatic model
BGA tin ball pitch e nyane haholo (0.15-0.6) BGA chips ka letsoho ho ea patch e tla ba le liphoso 'me e baka habonolo tjheseletsa e mpe.Optical alignment molao-motheo ke ho sebelisa spectroscopic prism imaging sisteme ho hōlisa manonyeletso BGA solder le PCB pads, e le hore litšoantšo tsa bona tse phahameng li kopana ka mor'a patching patch, e leng tla qoba liphoso tse etsahalang ho patching.Sistimi ea ho futhumatsa e tla sebetsa ka bo eona kamora hore patching e phetheloe, 'me ho tla ba le alamo ea buzzer ka mor'a hore welding e felile.
3. Mohlala o itekanetseng
Joalo ka ha lebitso le bolela, mofuta ona ke sistimi e ikemetseng ea ho sebetsa bocha, e ipapisitseng le pono ea mochini ea mokhoa ona oa theknoloji e phahameng ho fihlela ts'ebetso ea othomathike e nchafatsang.
NeoDen BGA Rework station
Phepelo ea Matla: AC220V±10%, 50/60HZ
Matla: 5.65KW(Max), hita e kaholimo (1.45KW)
Mofuthu o tlase (1.2KW) IR Preheater (2.7KW), Tse ling (0.3KW)
PCB Size: 412 * 370mm(Max); 6 * 6mm(Min)
BGA Chip Size: 60 * 60mm(Max); 2 * 2mm(Min)
IR Heater Boholo: 285 * 375mm
Sensor ea mocheso: 1 pcs
Mokhoa oa ts'ebetso: 7 ″ skrineng sa ho ama HD
Sistimi ea Taolo: Sistimi e ikemetseng ea taolo ea ho futhumatsa V2 (software copyright)
Sistimi ea Pontšo: Pontšo ea indasteri ea 15 ″ (720P skrineng se ka pele)
Sistimi ea Alignment: Sistimi ea ho nahana ka dijithale ea 2 ea Pixel SD, othomathike ea optical zoom e nang le laser: letšoao la matheba a mafubelu
Vacuum Adsorption: Ka ho iketsa
Ho nepahala ha Tokiso: ± 0.02mm
Taolo ea Mocheso: Taolo ea K-mofuta oa thermocouple e koetsoeng-loop ka ho nepahala ho fihla ho ± 3 ℃
Sesebelisoa sa ho Fepa: Che
Positioning: V-groove e nang le sebopeho sa bokahohle
Litekanyo: L685*W633*H850mm
Boima ba 'mele: 76KG
Nako ea poso: Dec-24-2021