Melemo ea BGA rework station ke efe?

Melemo ea hoBGA rework station?Ha re shebeng.

1. Khetho e matla le e phethahetseng ea ts'ebetso, ho hopola mefuta e robeli ea li-curve tsa mocheso, basebelisi ba ka khetha mofuta ofe kapa ofe oa ho futhumatsa ho latela litlhoko tsa desoldering.

2. Intelligent curve futhumatsang, o ka ka tsela e iketsang tlatsa eohle desoldering thulaganyou e ho ea ka e seng e setilwe mocheso mothinya, ho etsa eohle desoldering tshebetso ya saense ho feta.

3. Phetoho ea likarolo tse tharo tsa 'mele oa lebone, tsamaiso ea li-slide e khonang ho khutlisetsoa morao, e loketseng likarolo leha e le life tsa angle desoldering,' mele oa lebone la infrared le boemo ba laser, e le hore phetoho e be bonolo haholoanyane ho beha boemo bo nepahetseng haholoanyane.

4. Theknoloji e bohlale ea ho laola mocheso oa PID, taolo ea mocheso e nepahetseng haholoanyane, lekhalo le phethehile haholoanyane, le ka qoba ka katleho ho phahama ha mocheso ka potlako kapa ho phahama ho sa khaotseng ha mocheso le ho baka tšenyo ho chip kapa boto ea potoloho.

5.Ultra-high power preheating melt glue system, le tšebeliso ea lisebelisoa tse futhumatsang tsa infrared, ho kenella ka matla, ho futhumala ha sesebelisoa, ho laola mocheso o nepahetseng haholoanyane.E ka senya kapa ea tsosolosa BGA, SMD, CSP, LGA, QFP, PLCC le BGA e kenya bolo, mela e mengata ea li-plug le li-pin sockets (tse kang CPU socket le GAP plug row), e khonang ho kopana le k'homphieutha ka botlalo, buka ea ho ngolla lintlha, e- lipapali le litlhoko tse ling tsa BGA desoldering / rework, haholo-holo tse loketseng k'homphieutha leboea le boroa borokho desoldering.

6.Motsoalle oa mochine oa motho, pontšo e phethahetseng ea LCD, mokhoa oohle oa ho futhumatsa hore u utloisise ha u habanya.

7.Ponahalo e thata, molumo o bobebe, ho tloha qalong ho fihlela qetellong ho bonahatsa mokhoa oa ho beoa oa thekenoloji, oa ho beha tafole, e le hore u be le sebaka se eketsehileng, litaelo tse bonolo tsa ts'ebetso, e le hore u ka e bala.

Tlhaloso ea BGA Rework Station

Phepelo ea Matla: AC220V±10% 50/60HZ

Matla: 5.65KW(Max), hita e holimo (1.45KW)

Mofuthu o tlase (1.2KW)，IR Preheater (2.7KW), Tse ling (0.3KW)

PCB Size: 412 * 370mm(Max); 6 * 6mm(Min)

BGA Chip Size: 60 * 60mm(Max); 2 * 2mm(Min)

IR Heater Boholo: 285 * 375mm

Sensor ea mocheso: 1 pcs

Mokhoa oa ts'ebetso: 7 ″ skrineng sa ho ama HD

Sistimi ea Taolo: Sistimi e ikemetseng ea taolo ea ho futhumatsa V2 (software copyright)

Sistimi ea Pontšo: Pontšo ea indasteri ea 15 ″ (720P skrineng se ka pele)

Sistimi ea Alignment: Sistimi ea ho nahana ka dijithale ea 2 ea Pixel SD, othomathike ea optical zoom e nang le laser: letšoao la matheba a mafubelu

Vacuum Adsorption: Ka ho iketsa

Ho nepahala ha Tokiso: ± 0.02mm

Taolo ea Mocheso: Taolo ea K-mofuta oa thermocouple e koetsoeng-loop ka ho nepahala ho fihla ho ± 3 ℃

Sesebelisoa sa ho Fepa: Che

Positioning: V-groove e nang le sebopeho sa bokahohle

Litekanyo: L685*W633*H850mm

Boima ba 'mele: 76KG