I. BGA e pakiloeng ke mokhoa oa ho paka o nang le litlhoko tse phahameng ka ho fetisisa tsa ho tjheseletsa ha PCB e etsoa.Melemo ea eona ke e latelang:
1. Pini e khutšoanyane, bophahamo bo tlaase ba kopano, inductance e nyenyane ea parasitic le capacitance, ts'ebetso e babatsehang ea motlakase.
2. Ho kopanya ho phahameng haholo, lithakhisa tse ngata, sebaka se seholo sa pin, coplanar e ntle ea pin.Moeli oa sebaka sa pin ea electrode ea QFP ke 0.3mm.Ha o kopanya boto ea potoloho e cheselitsoeng, ho nepahala ho ntseng ho eketseha ha chip ea QFP ho thata haholo.Ho tšepahala ha khokahanyo ea motlakase ho hloka hore mamello e ntseng e eketseha e be 0.08mm.Lithako tsa li-electrode tsa QFP tse nang le sebaka se moqotetsane li tšesaane ebile lia fokola, ho bonolo ho sotha kapa ho robeha, e leng se hlokang hore ho ts'oane le ho hlaka pakeng tsa lithapo tsa boto ea potoloho ho tlameha ho netefatsoa.Ka lehlakoreng le leng, molemo o moholo oa sephutheloana sa BGA ke hore sebaka sa 10-electrode pin se seholo, sebaka se tloaelehileng ke 1.0mm.1.27mm, 1.5mm (Inch 40mil, 50mil, 60mil), mamello e ntseng e eketseha ke 0.3mm, e nang le mefuta e mengata e tloaelehileng. -e sebetsangMochine oa SMTlereflow ontongha e le hantle e ka fihlela litlhoko tsa kopano ea BGA.
II.Le ha BGA encapsulation e na le melemo e kaholimo, e boetse e na le mathata a latelang.Tse latelang ke mefokolo ea BGA encapsulation:
1. Ho thata ho hlahloba le ho boloka BGA ka mor'a tjheseletsa.Baetsi ba PCB ba tlameha ho sebelisa X-ray fluoroscopy kapa tlhahlobo ea X-ray layering ho etsa bonnete ba ho tšepahala ha khokahanyo ea li-welding board, 'me litšenyehelo tsa thepa li phahame.
2. Likarolo tsa motho ka mong tsa solder tsa boto ea potoloho li robehile, kahoo karolo eohle e tlameha ho tlosoa, 'me BGA e tlositsoeng e ke ke ea sebelisoa hape.
Nako ea poso: Jul-20-2021