Ts'ebetso ea ho beoa ha SMT, ka sekhahla se bitsoa mokhoa oa bophelo oa setsi sa ts'ebetso ea ho beoa, lik'hamphani tse ling li tlameha ho fihla ho 95% ka sekhahla se fihla ho mohala o tloaelehileng, ka hona, ka sekhahla sa maemo a holimo le a tlase, a bonts'a matla a tekheniki a setsi sa ts'ebetso ea ho beoa, boleng ba ts'ebetso. , ka sekhahla se ka ntlafatsa bokhoni ba k'hamphani, ho fokotsa litšenyehelo tsa tlhahiso, Z e bohlokoa ho khona ho fana ka botsitso, ho ntlafatsa khotsofalo ea bareki.
Tlhaloso ea sekhahla se otlolohileng
Sekhahla sa ho fihlela maemo a thomello ka nako e le 'ngoe.
Sekhahla se otlolohileng (First Pass Yield, FPY) ka ho toba se bolela: palo ea lihlahisoa tse ntle tse fetisitseng liteko tsohle lekhetlo la pele ts'ebetso e kenngoa ka har'a lihlopha tse 100 tsa PCB moleng oa tlhahiso.Ka lebaka leo, ka mor'a hore line tlhahiso rework kapa tokiso ho fetisa dihlahiswa teko, eseng karolo ea ho otlolohile-ka sekhahla lipalo.
Ke lintlha life tse amang sekhahla se otlolohileng
1. lisebelisoa (ho kenyeletsoa lisebelisoa tse fapaneng tsa lisebelisoa tsa elektroniki qalong, ho kenyelletsa le liboto tsa PCB)
2. peista ea solder
3. boleng le maikutlo a basebetsi
Mokhoa oa ho ntlafatsa le ho ntlafatsa sekhahla se otlolohileng
Sekhahla se otlolohileng se amana le phaello le mokhoa oa bophelo oa khoebo, ka hona feme e 'ngoe le e' ngoe ea chip e utloisisa ho ntlafatsa le ho ntlafatsa sekhahla se otlolohileng, 100% ka sebele e ke ke ea fihla, empa hape e na le tšepo ea ho ba le ho feta 98%.
Ka hona, o ka ntlafatsa sekhahla sa ho otloloha ka tse ling tsa lihokelo tse latelang.
1. Optimize ea pcb boto stencil moralo
Ho feta 70% ea boleng ba tjheseletsa ts'ebetsong ea khatiso ea solder peiste, e leng indasteri ea SMT e akaretsa lintlha tsa boiphihlelo, khatiso ea solder paste ke smt Z front process process, solder paste offset, hula ntlha, collapse, maemong a mangata ke bofokoli bo entsoeng ka stencil, stencil e ka 'na ea e-ba khōlō haholo / menyetla e nyenyane, lerako la sekoti, joalo-joalo e tla baka bobe bo boletsoeng ka holimo, bo lebisang ho li-pads tsa pcb holim'a peista e mpe, e fellang ka ho cheselletsa Bad, kahoo e ama tsela e otlolohileng. sekhahla.
2. Khetha mofuta o nepahetseng oa peista ea solder
Solder peista ke motsoako oa mefuta e fapaneng ya tšepe le fluxes, tšoanang le sesepa sa meno, solder peista e arotsoe ka 5, 3 le mefuta e meng e fapaneng ya solder peista, lihlahisoa tse fapaneng lokela ho khetha fapaneng solder peista bakeng sa khatiso.
Sengoloa se qaqileng mabapi le peista ea solder
SMT chip process moo mefuta ea solder peste, polokelo le ts'ebeliso ea kutloisiso ea mantlha ea tikoloho
3. FetolaMochini oa khatiso oa SMTsqueegee angle, khatello
Khatello ea mochine oa khatiso, angle e tla ama lintlha tsa solder paste, khatello e kholo, e tla etsa hore ho be le pente e fokolang ea solder, 'me ka tsela e fapaneng, angle Z e ntle ke likhato tse 45-60.
4. Reflow ontongmothinya mocheso
Ho ea ka lihlahisoa tse fapaneng, fetola nako preheating, reflow mocheso mothinya, sebelisa sebopi mocheso tester, haufi le mocheso sebele oa tlhahiso, 'me joale fumana sebōpi mocheso mothinya,' me joale lokisa sebōpi mocheso mothinya, e le hore mocheso sebōpi. curve tumellanong le solder peista le lihlahisoa soldering ditlhoko.
Nako ea poso: Feb-17-2022