PCBA Thermal Pads Design Litlhokahalo

1. Thermal pad ke eng

Ho thoeng ke liphaephe tsa mocheso, li bua ka tlase ho likarolo tse nang le lehlakoreng la tšepe la liphahlo tsa ho senya mocheso, hangata matla a batlang a le manyenyane, haholo-holo ka liphahlo tsa ho senya mocheso holim'a mekoti ea ho senya mocheso ho ea fatše.E le hore ho molemo mocheso dissipation, ka linako tse ling lokela ho meralo mocheso teba lesoba bakeng sa ka-hole (eseng polaka lesoba), e le hore reflow soldering ho qhibiliha solder tla phalla ka morao, sebopeho sa lifaha thini, kahoo ama solder peista khatiso ka. bokahodimo ba difaha.

2. Litlhoko tsa moralo

(1) E le ho fokotsa ts'ebetso ea likhahla tsa thini, sekoti se ka etsoa bakeng sa bophara ba ≤ 0.30mm kapa ≥ 0.80mm lesoba;Moralo oa resin plug hole surface plating (POFV) o ka boela oa sebelisoa.

(2) Ala liphaephe tsohle tsa ho teba ha mocheso sebakeng sa bobeli sa solder ho amohela boteng ba lifaha tsa thini.

(3) Etsa moralo oa mocheso oa mocheso.Haeba PCB boto botenya < 2.4mm, 'me palo ea le dikarolo fatše amanang le lesoba mocheso teba

Likarolo tsaNeoDen IN12C reflow ontong

1. Sistimi e kentsoeng ka har'a welding filtration system, ho sefa ka katleho ha likhase tse kotsi, ponahalo e ntle le ts'ireletso ea tikoloho, e tsamaellana haholo le ts'ebeliso ea tikoloho ea maemo a holimo.

2. Tsamaiso ea tsamaiso e na le litšobotsi tsa ho kopanya ho phahameng, karabelo e nakong, tekanyo e tlaase ea ho hlōleha, tlhokomelo e bonolo, joalo-joalo.

3. Moqapi oa module oa ho futhumatsa o ikhethang, o nang le taolo e phahameng ea mocheso o nepahetseng, kabo ea mocheso o ts'oanang sebakeng sa matšeliso a mocheso, ts'ebetso e phahameng ea matšeliso a mocheso, matla a tlaase a matla le litšobotsi tse ling.

4. e ntle ebile e na le ts'ebetso ea alamo e khubelu, e mosehla le e tala ea moralo oa pontšo.

5. Motlakase oa koloi o entsoeng ka mokhoa o hlophisitsoeng ho ea ka litšobotsi tsa lebanta la mofuta oa B, ho netefatsa lebelo le ts'oanang le bophelo bo bolelele.