Mefuta e mengata ea li-substrate tse sebelisetsoang li-PCB, empa ka bophara li arotsoe ka mekhahlelo e 'meli, e leng lisebelisoa tsa inorganic substrate le lisebelisoa tsa organic substrate.
Lisebelisoa tsa inorganic substrate
Inorganic substrate haholo-holo lipoleiti tsa ceramic, lisebelisoa tsa ceramic circuit substrate ke 96% alumina, tabeng ea ho hloka substrate e matla e phahameng, 99% ea lisebelisoa tse hloekileng tsa aluminium li ka sebelisoa empa mathata a ho sebetsana le alumina a hloekileng haholo, tekanyo ea lihlahisoa e tlaase, kahoo tšebeliso ea theko ea aluminium e hloekileng e phahame.Beryllium oxide hape ke thepa ea ceramic substrate, ke metal oxide, e na le thepa e ntle ea ho kenya motlakase le conductivity e ntle ea mocheso, e ka sebelisoa e le karoloana bakeng sa lipotoloho tse phahameng tsa matla.
Li-circuits tsa Ceramic Circle li sebelisoa haholo ho li-circuits tse kopaneng tsa lifilimi tse teteaneng le tse tšesaane, tse nang le melemo eo likaroloana tsa potoloho ea lintho tse phelang li ke keng tsa tšoana le tsona.Ka mohlala, CTE ea substrate ea potoloho ea ceramic e ka lumellana le CTE ea matlo a LCCC, kahoo botšepehi bo botle bo kopanetsoeng ba solder bo tla fumanoa ha ho bokella lisebelisoa tsa LCCC.Ntle le moo, li-ceramic substrates li loketse ts'ebetso ea mouoane oa vacuum tlhahiso ea li-chip hobane ha li ntše likhase tse ngata tse halefileng tse bakang ho fokotseha ha boemo ba vacuum leha e futhumetse.Ntle le moo, li-substrates tsa ceramic le tsona li na le ho hanyetsa mocheso o phahameng, pheletso e ntle ea bokaholimo, botsitso bo phahameng ba lik'hemik'hale, ke sebaka se ratoang sa potoloho bakeng sa li-circuits tse nyalisitsoeng tse teteaneng le tse tšesaane le li-circuits tsa li-multi-chip micro-assembly.Leha ho le joalo, ho thata ho sebetsa ka substrate e kholo le e bataletseng, 'me e ke ke ea etsoa mohahong oa litempe tse ngata tse kopantsoeng ho finyella litlhoko tsa tlhahiso e ikemetseng Ho phaella moo, ka lebaka la matla a mangata a dielectric kamehla a lisebelisoa tsa ceramic, kahoo e. hape ha e tšoanelehe bakeng sa li-substrates tsa potoloho ea lebelo le holimo, 'me theko e batla e phahame.
Lisebelisoa tsa organic substrate
Lisebelisoa tsa organic substrate li entsoe ka thepa e matlafatsang joalo ka lesela la fiber ea khalase (pampiri ea fiber, mat a khalase, joalo-joalo), e kenngoeng ka resin binder, e omisitsoeng ka sekheo, ebe e koaheloa ka foil ea koporo, 'me e entsoe ka mocheso o phahameng le khatello.Mofuta ona oa substrate o bitsoa copper-clad laminate (CCL), eo hangata e tsejoang e le liphanele tsa koporo, ke lisebelisoa tse ka sehloohong tsa ho etsa li-PCB.
CCL mefuta e mengata ea mefuta e mengata, haeba thepa e matlafatsang e sebelisetsoang ho arola, e ka aroloa ka likarolo tse 'nè tse entsoeng ka pampiri, tse entsoeng ka lesela la khalase, tse entsoeng ka motsoako (CEM) le likarolo tse' nè tsa tšepe;ho ea ka organic resin binder e sebelisetsoang ho arola, 'me e ka aroloa ka phenolic resin (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) le polyphenylene ether resin (PPO);haeba substrate e thata ebile e tenyetseha ho arola, 'me e ka aroloa ka CCL e thata le CCL e tenyetsehang.
Hajoale e sebelisoang haholo tlhahiso ea mahlakoreng a mabeli a PCB ke epoxy glass fiber circuit substrate, e kopanyang melemo ea matla a matle a khalase ea khalase le ho thatafala ha epoxy resin, ka matla a matle le ductility.
Epoxy glass fiber circuit substrate e entsoe ka ho kenya resin ea epoxy ka lekhetlo la pele ka lesela la fiber ea khalase ho etsa laminate.Ka nako e ts'oanang, lik'hemik'hale tse ling li eketsoa, tse kang ho phekola, li-stabilizers, li-anti-flammability agents, li-adhesives, joalo-joalo Joale foil ea koporo e khomaretsoe 'me e hatelloa ka mahlakoreng a le mong kapa ka bobeli ba laminate ho etsa koporo e entsoeng ka khalase ea epoxy. laminate.E ka sebelisoa ho etsa li-PCB tse fapaneng tse nang le lehlakore le le leng, tse nang le mahlakore a mabeli le tse ngata.
Nako ea poso: Mar-04-2022