Khethollo ea li-substrates
Lisebelisoa tsa substrate tse hatisitsoeng ka kakaretso li ka aroloa ka mekhahlelo e 'meli: lisebelisoa tse thata tsa substrate le lisebelisoa tse tenyetsehang tsa substrate.Mofuta oa bohlokoa oa thepa ea substrate e thata ka kakaretso ke laminate ea koporo.E entsoe ka Reinforeing Material, e kenngoeng ka sekontiri sa resin, e omisitsoeng, e khaotsoe le e entsoeng ka laminated hore e be e se nang letho, ebe e koahetsoe ka foil ea koporo, e sebelisa letlapa la tšepe e le hlobo, 'me e sebetsoa ke mocheso o phahameng le khatello e phahameng ka mochine o chesang.Kakaretso ea multilayer semi-cured sheet, e apereng koporo ts'ebetsong ea tlhahiso ea lihlahisoa tse felileng (haholo-holo lesela la khalase le kolobisitsoeng ka resin, ka ho omisa).
Ho na le mekhoa e fapaneng ea ho arola laminate ea koporo.Ka kakaretso, ho ea ka lisebelisoa tse fapaneng tsa matlafatso tsa boto, e ka aroloa ka mekhahlelo e mehlano: setsi sa pampiri, khalase ea lesela la lesela, setsi sa composite (CEM series), laminated multilayer board base le lisebelisoa tse khethehileng (li-ceramics, tšepe ea motheo ea tšepe, joalo-joalo).Haeba boto e sebelisoang ke li-adhesives tse fapaneng tsa resin bakeng sa ho arola, pampiri e tloaelehileng - e thehiloeng CCI.Ho na le: resin ea phenolic (XPc, XxxPC, FR 1, FR 2, joalo-joalo), resin ea epoxy (FE 3), resin ea polyester le mefuta e meng.CCL e tloaelehileng ke epoxy resin (FR-4, FR-5), e leng mofuta o sebelisoang ka ho fetisisa oa lesela la fiber ea khalase.Ho phaella moo, ho na le li-resin tse ling tse khethehileng (lesela la khalase, lesela la polyamide, lesela le sa lohiloeng, joalo-joalo, e le lisebelisoa tse ekelitsoeng): bismaleimide modified trizine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), maleic anhydride imide - styrene resin (MS), polycyanate ester resin, polyolefin resin, joalo-joalo.
Ho ea ka ts'ebetso e thibelang lelakabe ea CCL, e ka aroloa ka mofuta o thibelang lelakabe (UL94-VO, UL94-V1) le mofuta o sa chesehang (Ul94-HB).Lilemong tse 12 tse fetileng, kaha tlhokomelo e eketsehileng e lefshoa ho sireletsa tikoloho, mofuta o mocha oa CCL e thibelang malakabe e se nang bromine e arohane, e ka bitsoang "CCL e thibelang lelakabe e tala".Ka nts'etsopele e potlakileng ea theknoloji ea lihlahisoa tsa elektroniki, cCL e na le litlhoko tse phahameng tsa ts'ebetso.Ka hona, ho tloha sehlopheng sa ts'ebetso ea CCL, 'me e arotsoe ka CCL ea ts'ebetso e akaretsang, CCL e tlaase ea dielectric kamehla, mocheso o phahameng oa mocheso CCL (kakaretso ea poleiti L ka 150 ℃ ka holimo), coefficient e tlase ea mocheso oa mocheso CCL (e sebelisoang ka kakaretso holim'a substrate) le mefuta e meng. .
Tekanyetso ea ts'ebetsong ea substrate
Ka tsoelo-pele le tsoelo-pele e tsoelang pele ea thekenoloji ea elektronike, litlhoko tse ncha li lula li behiloe pele bakeng sa lisebelisoa tsa substrate tse hatisitsoeng, e le ho khothalletsa tsoelo-pele e tsoelang pele ea litekanyetso tsa lipoleiti tsa koporo.Hona joale, litekanyetso tse ka sehloohong tsa thepa ea substrate ke tse latelang.
1) Maemo a Naha bakeng sa Substrates Hajoale, Litekanyetso tsa naha bakeng sa substrates Chaena li kenyelletsa GB/T4721 — 4722 1992 le GB 4723 — 4725 — 1992. Tekanyetso ea li-laminate tsa koporo sebakeng sa Taiwan sa China ke maemo a CNS, a thehiloeng. ho maemo a Majapane a JI mme e ile ea ntšoa ka 1983.
Ka tsoelo-pele le tsoelo-pele e tsoelang pele ea thekenoloji ea elektronike, litlhoko tse ncha li lula li behiloe pele bakeng sa lisebelisoa tsa substrate tse hatisitsoeng, e le ho khothalletsa tsoelo-pele e tsoelang pele ea litekanyetso tsa lipoleiti tsa koporo.Hona joale, litekanyetso tse ka sehloohong tsa thepa ea substrate ke tse latelang.
1) Maemo a Naha bakeng sa Substrates Hajoale, maemo a naha a China bakeng sa li-substrates a kenyelletsa GB/T4721 — 4722 1992 le GB 4723 — 4725 — 1992. Tekanyetso ea li-laminate tsa koporo sebakeng sa Taiwan sa China ke maemo a CNS, a thehiloeng ho Tekanyetso ea JI ea Majapane mme e ile ea fanoa ka 1983.
2) Litekanyetso tse ling tsa naha li kenyelletsa maemo a Japanese JIS, American ASTM, NEMA, MIL, IPc, ANSI le UL standard, British Bs standard, German DIN le VDE standard, French NFC le UTE standard, Canadian CSA standard, Australian AS standard, FOCT standard. ea mehleng ea Soviet Union, le maemo a machaba a IEC
Maemo a kakaretso a kakaretso ea mabitso a tloaelehileng a bitsoa lefapha la tlhahiso ea mabitso a tloaelehileng
JIS- Japan Industrial Standard - Mokhatlo oa Litlhaloso tsa Japane
ASTM- American Society for Laboratory Materials Standards -Mokhatlo oa Amerika oa fof Testi 'ng le Materials
NEMA- Mokhatlo oa Sechaba oa Lihlahisoa tsa Motlakase Standard -Nafiomll Electrical Manufactures
MH- United States Maemo a Sesole -Lefapha la Tšireletso Likarolo le Maemo a Khethehileng a Sesole
IPC- American Circuit Interconnection and Packaging Association Standard -Beke ea 'nete bakeng sa Interoonnecting le Packing EIectronics Circuits
ANSl- American National Standard Institute
Nako ea poso: Dec-04-2020