Mefokolo ea ho paka haholo e kenyelletsa deformation ea lead, base offset, warpage, chip breakage, delamination, voids, package e sa lekanang, li-burrs, likaroloana tsa kantle ho naha le pheko e sa phethahalang, jj.
1. Loto deformation
Lead deformation hangata e bolela ho falla ha lead kapa deformation e bakiloeng nakong ea phallo ea sealant ea polasetiki, eo hangata e bonts'itsoeng ke karo-karolelano ea x / L lipakeng tsa lateral lead displacement x le bolelele ba lead L. Ho kobeha ha pele ho ka lebisa ho lifupi tsa motlakase (haholo-holo. ka har'a liphutheloana tsa lisebelisoa tsa I / O tse phahameng haholo).Ka linako tse ling likhatello tse hlahisoang ke ho kobeha li ka lebisa ho phunyeha ha ntlha ea tlamo kapa ho fokotseha ha matla a tlamo.
Lintlha tse amang bonding ba lead li kenyelletsa moralo oa sephutheloana, moralo oa lead, thepa le boholo, thepa ea polasetiki ea ho bopa, ts'ebetso ea bonding, le mokhoa oa ho paka.Mekhahlelo ea keta e amang ho kobeha ha lead e kenyelletsa bophara ba lead, bolelele ba lead, moroalo oa khefu ea lead le letsoalo la lead, jj.
2. Base offset
Base offset e bua ka deformation le offset ea carrier (chip base) e tšehetsang chip.
Lintho tse amang phetoho ea motheo li kenyelletsa ho phalla ha motsoako oa ho bopa, moralo oa kopano ea leadframe, le thepa ea thepa ea motsoako oa ho bopa le leadframe.Liphutheloana tse kang TSOP le TQFP li kotsing ea ho fetoha le ho fetoha ha phini ka lebaka la liforeimi tsa tsona tse tšesaane.
3. Warpage
Warpage ke ho kobeha ka ntle ho sefofane le ho senyeha ha sesebelisoa sa sephutheloana.Warpage e bakoang ke ts'ebetso ea ho bōptjoa e ka lebisa litabeng tse ngata tse ka tšeptjoang tse kang delamination le chip cracking.
Warpage e ka boela ea lebisa mathateng a mangata a tlhahiso, joalo ka lisebelisoa tsa li-plasticized ball grid array (PBGA), moo warpage e ka lebisang ho solder ball coplanarity e futsanehileng, e bakang mathata a ho beha nakong ea ho phalla ha sesebelisoa bakeng sa kopano ho boto ea potoloho e hatisitsoeng.
Lipaterone tsa warpage li kenyelletsa mefuta e meraro ea lipaterone: concave e ka hare, convex e ka ntle le e kopantsoeng.Lik'hamphaning tsa semiconductor, ka linako tse ling concave e bitsoa "sefahleho se bososela" le convex e le "sefahleho sa ho lla".Lisosa tse ka sehloohong tsa warpage li kenyelletsa ho se lumellane ha CTE le pholiso / ho fokotseha ha khatello.Ba morao ha baa ka ba fumana tlhokomelo e ngata qalong, empa lipatlisiso tse tebileng li senoletse hore ho fokotseha ha lik'hemik'hale tsa motsoako oa ho bōpa ho boetse ho phetha karolo ea bohlokoa ho warpage ea lisebelisoa tsa IC, haholo-holo ka liphutheloana tse nang le botenya bo fapaneng ka holimo le ka tlaase ho chip.
Nakong ea ts'ebetso ea ho phekola le ka mor'a ho phekola, motsoako oa ho bopa o tla fokotseha ka lik'hemik'hale ka mocheso o phahameng oa phekolo, o bitsoang "thermochemical shrinkage".Ho fokotseha ha lik'hemik'hale nakong ea phekolo ho ka fokotsoa ka ho eketsa mocheso oa phetoho ea khalase le ho fokotsa phetoho ea coefficient ea katoloso ea mocheso ho potoloha Tg.
Warpage e ka boela ea bakoa ke lintlha tse kang ho hlophisoa ha motsoako oa ho bopa, mongobo ka har'a motsoako oa ho bopa, le geometry ea sephutheloana.Ka ho laola thepa ea ho bopa le ho hlophisoa, mekhahlelo ea ts'ebetso, sebopeho sa sephutheloana le tikoloho ea pele ho encapsulation, warpage ea sephutheloana e ka fokotsoa.Maemong a mang, warpage e ka lefshoa ka ho kenya karolo e ka morao ea kopano ea elektronike.Mohlala, haeba likhokahano tsa kantle tsa boto e kholo ea ceramic kapa boto ea li-multilayer li ka lehlakoreng le le leng, ho li koahela ka lehlakoreng le ka morao ho ka fokotsa ntoa.
4. Ho robeha ha chip
Likhatello tse hlahisoang ke mokhoa oa ho paka li ka lebisa ho robeheng ha chip.Ts'ebetso ea ho paka hangata e mpefatsa li-micro-cracks tse entsoeng ts'ebetsong ea kopano e fetileng.Wafer kapa chip thinning, ho sila ka morao, le chip bonding ke mehato e ka lebisang ho meleng ha mapetsong.
Chip e petsohileng, e hlolehileng ka mochini ha e hlile e baka ho hloleha ha motlakase.Hore na ho phatloha ha chip ho tla fella ka ho hloleha ha motlakase hang-hang ha sesebelisoa ho boetse ho itšetlehile ka tsela ea ho hōla ha crack.Ka mohlala, haeba petso e hlaha karolong e ka morao ea chip, e ka 'na ea se ke ea ama mehaho leha e le efe e bonolo.
Hobane li-wafers tsa silicon li tšesaane ebile lia brittle, liphutheloana tsa wafer-level li kotsing ea ho phatloha habonolo.Ka hona, li-parameter tsa ts'ebetso tse joalo ka khatello ea clamping le khatello ea phetoho ea molding ts'ebetsong ea ho bopa e tlameha ho laoloa ka thata ho thibela ho phatloha ha chip.Liphutheloana tse pakiloeng tsa 3D li tloaetse ho phatloha ka lebaka la ts'ebetso ea ho bokellana.Lintlha tsa moralo tse amang ho phatloha ha chip ka har'a liphutheloana tsa 3D li kenyelletsa sebopeho sa chip stack, botenya ba substrate, bophahamo ba molumo le botenya ba sleeve ea hlobo, jj.
Nako ea poso: Feb-15-2023