Chip Component Pad Design Mefokolo

1. 0.5mm pitch QFP pad bolelele e telele haholo, e bakang potoloho e khutšoanyane.

2. Li-socket pads tsa PLCC li khutšoanyane haholo, e leng se etsang hore ho be le soldering ea bohata.

3. Bolelele ba IC's pad bo telele haholo mme palo ea solder peste e kholo e bakang potoloho e khuts'oane ha reflow.

4. Li-chip pads tse nang le mapheo li telele haholo hore li ka ama serethe sa solder le ho futsaneha ha serethe.

5. Bolelele ba pad ea likarolo tsa chip bo khutšoanyane haholo, bo fella ka ho fetoha, potoloho e bulehileng, e ke ke ea rekisoa le mathata a mang a soldering.

6. Bolelele ba pad ea likarolo tsa mofuta oa chip ke nako e telele haholo, e bakang seemahale se emeng, potoloho e bulehileng, manonyeletso a solder a fokolang tin le mathata a mang a solder.

7. Bophara ba pad bo pharaletse haholo bo bakang ho falla ha likaroloana, solder e se nang letho le thini e sa lekaneng holim'a pampiri le liphoso tse ling.

8. Bophara ba Pad bo pharaletse haholo, boholo ba sephutheloana sa likaroloana le ho se tsamaisane.

9. Bophara ba pad bo moqotetsane, bo ama boholo ba solder e entsoeng ka ho qhibilihisoa hammoho le karolo ea ho qetela ea solder le tšepe ea holim'a tšepe e phatlalalitsoeng ho PCB pad motsoako, e amang sebopeho sa motsoako oa solder, ho fokotsa ho tšepahala ha motsoako oa solder.

10. Pad e amanang ka ho toba le sebaka se seholo sa foil ea koporo, e hlahisang seemahale se emeng, solder ea bohata le liphoso tse ling.

11. Pad pitch e kholo haholo kapa e nyane haholo, karolo ea solder e qetellang e ke ke ea kopana le pad overlap, e tla hlahisa seemahale, ho falla, solder ea bohata le liphoso tse ling.

12. Pad pitch e kholo haholo e bakang ho sitoa ho theha motsoako oa solder.