Ho kenngoa ha anti-deformation ea likarolo tsa boto ea potoloho e hatisitsoeng

1. Ka foreime matlafatso le PCBA tlhomamiso, PCBA le chassis tlhomamiso thulaganyou e, e sothehileng PCBA kapa warped matlafatso foreime kenngwa tshebetsong ka ho toba kapa ho qobelloa ho instola tse le PCBA tlhomamiso ka cheisi holofetse.Khatello ea ho kenya e baka tšenyo le ho robeha ha likarolo tsa likarolo (haholo-holo li-IC tse phahameng tse kang BGS le likaroloana tsa holim'a metsi), likoti tse tsamaisanang tsa li-PCB tse ngata le melapo ea ka hare ea khokahanyo le lipampiri tsa li-PCB tse ngata.Ho warpage ha e kopana le ditlhoko tsa PCBA kapa matlafatsoa foreime, moqapi lokela ho sebelisana le setsebi pele tlhomamiso ka likarolo tsa eona seqha (sothoe) ho nka kapa ho qapa mehato e atlehang "pheda".

2. Tlhahlobo

a.Har'a likarolo tsa chip capacitive, monyetla oa ho ba le liphoso ho li-ceramic chip capacitor ke tse phahameng ka ho fetisisa, haholo tse latelang.

b.PCBA inama le deformation bakoang ke khatello ea kelello ea terata dingata tlhomamiso.

c.Flatness ea PCBA ka mor'a soldering e kholo ho feta 0.75%.

d.Moralo oa asymmetric oa li-pads lipheletsong tse peli tsa ceramic chip capacitor.

e.Lisebelisoa tse nang le nako ea soldering e kholo ho feta 2s, mocheso oa soldering o phahametse 245 ℃, le linako tsohle tsa soldering tse fetang boleng bo boletsoeng ba makhetlo a 6.

f.Coefficient e fapaneng ea katoloso ea mocheso lipakeng tsa ceramic chip capacitor le thepa ea PCB.

g.Moralo oa PCB o nang le masoba a ho lokisa le li-ceramic chip capacitor tse haufi haholo li baka khatello ea maikutlo ha u tiisa, jj.

h.Esita le haeba ceramic chip capacitor e na le boholo bo lekanang ba pad ho PCB, haeba palo ea solder e ngata haholo, e tla eketsa khatello ea kelello ho chip capacitor ha PCB e kobehile;palo e nepahetseng ea solder e lokela ho ba 1/2 ho isa ho 2/3 ea bophahamo ba ntlha ea solder ea chip capacitor.

ke.Khatello efe kapa efe ea kantle ea mochini kapa ea mocheso e tla baka mapetsong a li-ceramic chip capacitor.

• Mapetsong a bakoang ke extrusion ea mounting pick and place head will show up on the surface of the component , hangata e le lekhalo le chitja kapa halofo ea khoeli e bōpehileng ka phetoho ea 'mala, bohareng kapa haufi le bohareng ba capacitor.
• Mapetsong a bakoang ke litlhophiso tse fosahetseng tsaho khetha le ho beha mochinimekhahlelo.Hlooho ea seholima e sebelisa tšupu e hulang vacuum kapa clamp e bohareng ho beha karolo, 'me khatello e feteletseng ea Z-axis e theohelang e ka senya karolo ea ceramic.Haeba matla a lekaneng a lekaneng a sebelisoa ho khetha le ho beha hlooho sebakeng se seng ntle le sebaka se bohareng sa 'mele oa ceramic, khatello ea kelello e sebelisoang ho capacitor e ka' na ea e-ba khōlō ho lekana ho senya karolo.
• Khetho e sa nepahalang ea boholo ba chip pick le hlooho ea sebaka e ka baka ho phatloha.Sebaka se senyenyane sa ho khetha le ho beha hlooho se tla tsepamisa matla a ho bea nakong ea ho beoa, e leng se etsang hore sebaka se senyenyane sa ceramic chip capacitor se be tlas'a khatello e matla, e leng se etsang hore ho be le li-ceramic chip capacitor tse senyehileng.
• Palo e sa tsitsang ea solder e tla hlahisa kabo e sa tsitsang ea khatello ea maikutlo ho karolo, 'me ka lehlakoreng le leng e tla hatisa mahloriso le ho phatloha.
• Sesosa sa mapetsong ke porosity le mapetsong pakeng tsa likarolo tsa ceramic chip capacitor le ceramic chip.

3. Mehato ea tharollo.

Matlafatsa tlhahlobo ea li-ceramic chip capacitor: Li-ceramic chip capacitor li hlahlojoa ka microscope ea mofuta oa C (C-SAM) le microscope ea laser acoustic (SLAM), e khonang ho lekola li-capacitor tse haellang tsa ceramic.