Liteishene tsa rework tsa SMT li ka aroloa ka mefuta ea 4 ho latela kaho, ts'ebeliso le ho rarahana ha tsona: mofuta o bonolo, mofuta o rarahaneng, mofuta oa infrared le mofuta oa moea o chesang oa infrared.
1. Mofuta o bonolo: mofuta ona oa lisebelisoa tsa rework o tloaelehile ho feta ts'ebetso e ikemetseng ea tšepe ea tšepe, e ka khetha ho sebelisa litlhaloso tse fapaneng tsa hlooho ea tšepe ho ea ka likarolo tsa likarolo, karolo ea tsamaiso le sethala sa ts'ebetso sa PCB se tsitsitseng, haholo-holo bakeng sa ho pholletsa le lesoba. ho futhumatsa likarolo, ho soasoa ha chip le ho tlosa chip, joalo-joalo.
2. Mofuta o rarahaneng: mofuta o rarahaneng oa ho lokisa lisebelisoa le lisebelisoa tse bonolo tsa ho sebetsa hape, ha li bapisoa le ka bobeli li ka arola likarolo, pente ea solder ea letheba, lisebelisoa tse ntseng li eketseha le likarolo tsa welding, ntho ea bohlokoa ka ho fetesisa ke sistimi ea ho beha setšoantšo, sistimi ea taolo ea mocheso, ts'ebetso e laoloang ea vacuum le Sistimi ea tokollo, joalo-joalo. Mofuta ona oa lisebelisoa haholo-holo o na le sesebelisoa sa GOOT,BGA reworking station, joalo-joalo.
3. Mofuta oa infrared: lisebelisoa tsa rework tsa mofuta oa infrared haholo-holo ke ts'ebeliso ea matla a futhumatsang a mahlaseli a infrared ho phethela ts'ebetso ea likarolo, mocheso oa mocheso oa mahlaseli oa infrared o na le ts'ebetso e ts'oanang, ha ho na ntho e pholileng ea lehae e etsahalang ha ho futhumala ha moea o chesang, ho futhumala ha pele ho lieha, ho futhumala ha morao ka potlako, ho phunyeletsa hoo e batlang e le matla, empa ho sebetsa hape ka makhetlo a 'maloa boto ea PCB ho bonolo ho etsa hore delamination ka sekoting ha e sebetse.
4. Mofuta oa moea o chesang oa infrared: lisebelisoa tsa ho tsosolosa mofuta oa moea o chesang oa infrared ka ho kopanya li-infrared le thermal sub heat for rework, ho tsepamisa maikutlo melemo ea lisebelisoa tsa ho tsosolosa moea o chesang le o chesang.Haeba u sebelisa e tletseng infrared tsoela pele futhumatsang, ho le bonolo ho lebisa mocheso hloka botsitso, infrared futhumatsang holim tla ba batlang e le khōlō, ka nako eo ba bang ba potting boto haeba e sa sireletsoa, etsa BGA tla lebisa ho pota-potileng chip phatlohile thini, tse kang ho lokisa laptop ea ka kakaretso. eseng ho futhumatsa ka botlalo, empa ts'ebeliso ea mocheso o kopaneng oa moea o chesang oa infrared.
Likarolo tsaNeoDenBGA rework station
Phepelo ea Matla: AC220V±10%, 50/60HZ
Matla: 5.65KW(Max), hita e kaholimo (1.45KW)
Mofuthu o tlase (1.2KW) IR Preheater (2.7KW), Tse ling (0.3KW)
PCB Size: 412 * 370mm(Max); 6 * 6mm(Min)
BGA Chip Size: 60 * 60mm(Max); 2 * 2mm(Min)
IR Heater Boholo: 285 * 375mm
Sensor ea mocheso: 1 pcs
Mokhoa oa ts'ebetso: 7 ″ skrineng sa ho ama HD
Sistimi ea Taolo: Sistimi e ikemetseng ea taolo ea ho futhumatsa V2 (software copyright)
Sistimi ea Pontšo: Pontšo ea indasteri ea 15 ″ (720P skrineng se ka pele)
Sistimi ea Alignment: Sistimi ea ho nahana ka dijithale ea 2 ea Pixel SD, othomathike ea optical zoom e nang le laser: letšoao la matheba a mafubelu
Vacuum Adsorption: Ka ho iketsa
Ho nepahala ha Tokiso: ± 0.02mm
Taolo ea Mocheso: Taolo ea K-mofuta oa thermocouple e koetsoeng-loop ka ho nepahala ho fihla ho ± 3 ℃
Sesebelisoa sa ho Fepa: Che
Positioning: V-groove e nang le sebopeho sa bokahohle
Nako ea poso: Dec-09-2022