Ho Tla Etsahala'ng Haeba Boitsebiso ba PCB le Boholo bo sa Loke?

1. Ho ea ka litokisetso tsa GJB3835, ka mor'a warping le deformation tjheseletsa ea PCBA kareflow ontongtjheseletsa tshebetso, warping palo e kahodimodimo le khopameng ke ke ho feta 0.75%, 'me warping le khopameng ea PCB le likarolo tse ntle-spacing ke ke ho feta 0.5%.
2. PCBA e nang le warping e totobetseng, haeba PCBA e nang le likarolo tse ngata e na le khatello ea kelello ea deformation, ho kenyelletsa le matlafatso ea ts'ebetso ea tšepe ea foreimi, mochine oa mochine oa chassis sethaleng sa chassis, tataiso ea seporo ea tataiso ea groove le ts'ebetso e 'ngoe ea reverse deformation (ho kenya) ho senya kapa ho robeha ha likoti tsa metallization tsa lithapo tse hatisitsoeng tse kang IC e phahameng haholo le likarolo tse ling tse etellang pele, li-joints tsa BGA / CCGA tsa solder le masoba a relay a multilayer PCB.

 

3. PCBA e nang le ho khopama kapa ho khumama ho fihlela ho 0.75% e tla kenngoa ho latela litokisetso tse latelang haeba ho netefatsoa hore khatello ea kelello ea deformation ha e bake tšenyo ea likarolo le mathata a ho tšepahala 'me e hloka ho tsoela pele ho sebelisoa.
Kenya (kenya) le screw fastening ka ho toba sethaleng chassis, tataiso groove, tataiso seporo kapa tšiea ha ea lokela ho etsoa ho qoba tšenyo e eketsehileng ho likarolo le masoba metallized bakoang ke reverse deformation khatello ea kelello ea PCB tlhomamiso kopano.
Mehato ea ho robala sebakeng sa heno (lisebelisoa tsa motlakase kapa tsa mocheso) li tla nkoa sebakeng seo ho sona lekhalo la ho sotha le ho khumama le leholo ka ho fetisisa, ntle le ho ama ts'episo ea ho kenya le ho netefatsa liteishene tse kholo tsa mocheso kapa tsa conductive.Karolo ea warping e ka kenngoa le ho tlamelloa feela tlas'a boemo ba hore kopano ea boto ea potoloho e holofetseng ha e na khatello ea maikutlo e fapaneng.

 

4. The rigidity le deformation bokgoni ba thepa e khethiloeng bakeng sa sebopeho sa ho kenya PCB le foreimi e matlafatsang e ke ke ea baka ho sotha kapa ho senyeha ha seqha kapa ho fetola phetoho ea PCB.

 

5. Bakeng sa multilayer PCBA le khopameng e totobetseng kapa ho inama, kapa khopamo (ho inama) ka tlase ho 0,75%, haholo-holo PCBA hlomelloa le phahameng segokanyipalo IC, BGA/CCGA likarolo, khalemelo kapa anti-deformation tlhomamiso ea PCB lokela ho ka tieo thibelo. .

 

mohala o felletseng oa tlhahiso ea likoloi tsa SMT

NeoDen e fana ka tharollo ea mohala oa kopano ea SMT e felletseng, ho kenyeletsoa onto ea SMT reflow, mochini o hlabollang oa wave,ho khetha le ho beha mochini, printa ea solder paste, PCB loader, PCB unloader, chip mounter, Mochini oa SMT AOI, mochini oa SMT SPI, mochini oa SMT X-Ray, lisebelisoa tsa mohala oa kopano ea SMT, tlhahiso ea PCB Lisebelisoa tsa lisebelisoa tsa SMT, joalo-joalo mefuta efe kapa efe ea mofuta oa SMT eo u ka e hlokang, ka kopo ikopanye le rona bakeng sa tlhaiso-leseling e batsi:

Zhejiang NeoDen Technology Co., Ltd

Lengolo-tsoibila:info@neodentech.com


Nako ea poso: Jun-02-2021

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